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        CP12 proberLocation:Home  >>  Product

        CP12 prober

         

        Item

        CP12 prober

        Dimension

        1620mm(W) *1230D*1450mm(H)

        Wafer

        200mm,300mm

        Wafer thickness

        250~2000μm

        Die Size

        350μm ~76,000μm

        Transfer mode

        Vacuum suction, dual arms

        Accuracy

        XY±1.5μmZ±2.5μm

        XY platform

        Probing area ± 170mm, repeated positioning accuracy ± 1μm

        Z axis

        Repeated positioning accuracy ± 1.5μm, max speed 30mm/s

        Force

        50kg (optional 200kg)

        Calibration

        Image calibration, with high/low–power template

        Index time

        240ms (based on die size 6mm,Z clearance 0.5mm)

        Test temperature

        Ambient~150±1

        Communication interface

        GPIB, reserved TTL and RS232

        Option

        ID reading, auto card exchange

        Refer to the prober for CIS and SOC device.

         

        Copyright: Hangzhou ChangChuan Technology Co.,Ltd. Address: No. 410 Jucai Road, Binjiang District, Hangzhou

        Tel: +86-571-85096193 Fax: +86-571-88830180 Technical support: GXR Network

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